Current position: Home >> Scientific Research >> Paper Publications

Ke Wang

Personal Information

Associate professor
Supervisor of Master's Candidates

Paper Publications

Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)

Hits:

Journal:Precision engineering-Journal of the international societies for precision engineering and nanotechnology

Indexed by:Journal paper

Discipline:Engineering

Translation or Not:no

Date of Publication:2019-07-03

Included Journals:SCI、EI

Pre One:Preparation of Flat and Smooth Copper Surface by Jet Electrochemical Machining and Electrochemical Polishing